ELECTROMAGNETIC
WAVE ABSORPTION TYPE
Silicone Gap Filler Pad for Absorption of Electromagnetic Wave
Features
- Effective to absorb and damp a wide range of electromagnetic waves.
- Also effective as a high performance thermal interface material.
- Easily filling small gaps of IC chip surface with soft gel texture.
- Good workability to simply insert the product between circuit board.
- Self-adhesive gel surface does not require any adhesive tape for assembly.
- Extremely low level of low molecular siloxane.
Sarcon® Electromagnetic Wave Absorption Type Materials
- SARCON® EGR-11F
- General heat transfering.
- Hot Wire: 1.5 | Hot Disk: 1.5
Magnetic Characteristics
Decoupling Performance in Near Field
Typical Product Properties
| Test Properties | Unit | EGR-11F | Test Method | |
| Physical Properties | Thickness* | mm | 0.5 to 3.0 | ASTM D374 |
| Specific Gravity | – | 3.1 | ASTM D792 | |
| Hardness | Shore OO | 56 | ASTM D2240 | |
| Color | – | Dark Gray | Visual | |
| Electrical Properties | Volume Resistivity | Ohm-m | 1x1010 | ASTM D257 |
| Breakdown Voltage | V/mm | 500 | ASTM D149 | |
| Dielectric Constant | 50Hz | 28.33 | ASTM D150 | |
| 1kHz | 27.05 | |||
| 300kHz | 26.09 | |||
| Dissipation Factor | 50Hz | 0.031 | ASTM D150 | |
| 1kHz | 0.020 | |||
| 300kHz | 0.005 | |||
| Thermal Properties | Thermal Conductivity unit : W/m-K | Hot Wire | 1.0 | ASTM D2326 |
| Hot Disk | 0.8 | ISO/CD 22007-2 | ||
| Recommended Operating Temp. | ˚C | -30 to +120 | – | |
| ˚F | -22 to +248 | |||
| Flame Retardant | – | V-0 | UL94 | |
| a) Hardness : the highest value by using Shore OO. | |
| b) Thermal Conductivity | : Measured by using Hot Wire method, refer to Fujipoly Test method “FTM P-1620”. See Here |
| : Measured by using Hot Disk method, refer to Fujipoly Test method “FTM P-1612”. See Here | |
| * Some details of thickness. See Here |
Compression Force
| Compression Ratio | EGR-11F | |||
| 50EG-11F | 100EG-11F | 200EG-11F | 300EG-11F | |
| 10% | 54 (12.2 | 41 (9.3) | 60 (13.6) | 56 (12.7 |
| 20% | 288 (65.3) | 225 (51.0) | 187 (42.4) | 110 (24.9) |
| 30% | 566 (128.2) | 422 (95.6) | 309 (70.0) | 202 (45.8) |
| 40% | 879 (199.1) | 590 (133.7) | 474 (107.4) | 335 (75.9) |
| 50% | 1132 (256.5) | 813 (184.2) | 699 (158.4) | 511 (115.8) |
| Sustain | 846 (191.7) | 408 (92.4) | 320 (72.5) | 253 (57.3) |
c) Sustain: Sustain 50% at 1 minute later.
d) Measured by using ASTM D575-91(2012) for reference. See Here
Thermal Resistance
| Pressure | EGR-11F | |||
| 50EG-11F | 100EG-11F | 200EG-11F | 300EG-11F | |
| 100kPa 14.5psi | 6.8 (1.05) | 9.6 (1.48) | 15.0 (2.33) | 24.1 (3.74) |
| 300kPa 43.5psi | 6.4 (0.99) | 8.8 (1.36) | 12.8 (1.98) | 20.0 (3.10) |
| 500kPa 72.5psi | 6.1 (0.95) | 8.4 (1.30) | 11.5 (1.79) | 18.0 (2.79) |
e) Measured by using ASTM D5470 equivalent (TIM tester 1300), refer to Fujipoly Test method “FTM P-3050”. See Here
Fujipoly: Thermal Interface Materials
