ELECTROMAGNETIC
WAVE ABSORPTION TYPE

Silicone Gap Filler Pad for Absorption of Electromagnetic Wave

Features
  • Effective to absorb and damp a wide range of electromagnetic waves.
  • Also effective as a high performance thermal interface material.
  • Easily filling small gaps of IC chip surface with soft gel texture.
  • Good workability to simply insert the product between circuit board.
  • Self-adhesive gel surface does not require any adhesive tape for assembly.
  • Extremely low level of low molecular siloxane.
Sarcon® Electromagnetic Wave Absorption Type Materials
  • SARCON® EGR-11F
  • General heat transfering.
  • Hot Wire: 1.5 | Hot Disk: 1.5

Magnetic Characteristics

Magnetic Characteristics

Decoupling Performance in Near Field

Decoupling Performance in Near Field

Typical Product Properties

Test PropertiesUnitEGR-11FTest Method
Physical
Properties
Thickness*mm0.5 to 3.0ASTM D374
Specific Gravity3.1ASTM D792
HardnessShore OO56ASTM D2240
ColorDark GrayVisual
Electrical
Properties
Volume ResistivityOhm-m1x1010ASTM D257
Breakdown VoltageV/mm500ASTM D149
Dielectric Constant50Hz28.33ASTM D150
1kHz27.05
300kHz26.09
Dissipation Factor50Hz0.031ASTM D150
1kHz0.020
300kHz0.005
Thermal
Properties
Thermal Conductivity unit : W/m-KHot Wire1.0ASTM D2326
Hot Disk0.8ISO/CD 22007-2
Recommended
Operating Temp.
˚C-30 to +120  –
˚F-22 to +248
Flame RetardantV-0UL94
a) Hardness : the highest value by using Shore OO.
b) Thermal Conductivity: Measured by using Hot Wire method, refer to Fujipoly Test method “FTM P-1620”. See Here
: Measured by using Hot Disk method, refer to Fujipoly Test method “FTM P-1612”. See Here
* Some details of thickness. See Here

Compression Force

Compression
Ratio
EGR-11F
50EG-11F100EG-11F200EG-11F300EG-11F
10% 54
(12.2
41
(9.3)
60
(13.6)
56
(12.7
20% 288
(65.3)
225
(51.0)
187
(42.4)
110
(24.9)
30% 566
(128.2)
422
(95.6)
309
(70.0)
202
(45.8)
40%879
(199.1)
590
(133.7)
474
(107.4)
335
(75.9)
50%1132
(256.5)
813
(184.2)
699
(158.4)
511
(115.8)
Sustain 846
(191.7)
408
(92.4)
320
(72.5)
253
(57.3)

c) Sustain: Sustain 50% at 1 minute later.
d) Measured by using ASTM D575-91(2012) for reference. See Here

Thermal Resistance

PressureEGR-11F
50EG-11F100EG-11F200EG-11F300EG-11F
100kPa
14.5psi
6.8
(1.05)
9.6
(1.48)
15.0
(2.33)
24.1
(3.74)
300kPa
43.5psi
6.4
(0.99)
8.8
(1.36)
12.8
(1.98)
20.0
(3.10)
500kPa
72.5psi
6.1
(0.95)
8.4
(1.30)
11.5
(1.79)
18.0
(2.79)

e) Measured by using ASTM D5470 equivalent (TIM tester 1300), refer to Fujipoly Test method “FTM P-3050”. See Here

Fujipoly: Thermal Interface Materials

Sarcon Electromagnetic Wave Absorption

ISO 9001:2015