form in place gap filler type

Highly Thermally Conductive and Electricity Insulative Silicone Compound

A highly conformable / thermally conductive type silicone compound. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic device.
SARCON® Form in Place Gap Filler TYPE easily forms and adheres to most surfaces,
shapes, and size of components.

Features
  • Fill large gaps while providing superior thermal transfer.
  • Conformable with very low compression forces.
  • Excellent vibration absorption capabilities.
  • Maintains all initial properties across a wide temperature range.
  • Used to “Form-in-Place” and remain form stable.
  • Requires no heat curing.
  • Will not cause corrosion on any metal surface.

Recommended Application

Form In Place Gap Filler Recommended Application

– SARCON Form in Place Gap Filler TYPE is superior to filling gaps as well as dissipating heat.
– Excellent workability / handling with its softness but no dripping and no pumping.

Compression Load Correlation of Fujipoly TIM Pad Products

Compression Load Correlation of Fujipoly TIM Pad Products

Packaging Options

• Pre-filled syringe: 30cc
• Cartridge: 325cc
• Custom packaging: Available on request
Packaging Options

Typical Product Properties

Test PropertiesUnitSPG-20ASPG-20BSPG-30BSPG-50ATest Method
Physical
Properties
Specific Gravity2.92.83.23.2ASTM D792
ColorLight GrayLight GrayApricotLight Sky BlueVisual
ViscosityPa-s1.0(1/s)6001,0002,6004,100ASTM D1824 -1.0(1/s)
0.5(1/s)1,0001,7004,0006,900ASTM D1824 -0.1(1/s)
TGA Weight Losswt%0.030.020.030.06Fujipoly Original
Thermal
Properties
Thermal ConductivityW/m-k2.02.13.15.0Hot Disk : ISO/CD 22007-2
Recommended
Operating Temp.
°C-40 to +150-40 to +150-40 to +150-40 to +150-
°F-40 to +302-40 to +302-40 to +302-40 to +302

a) Viscosity: Measured by Modular Advanced Rheometer System RV1 and the specimen flows to 0.5mm Gap between parallel plates.
b) TGA Weight Loss at 150°C(302°F) x24hrs , amount of sample: 2cm3 (0.12in3).
c) Thermal Conductivity : Measured by using Hot Disk method, refer to Fujipoly Test method “FTM P-1612”. See Here

Thermal Resistance and Reliability
Initial
GapSPG-20ASPG-20BSPG-30BSPG-50A
0.5mm / 0.02in2.1
(0.33)
1.8
(0.28)
1.3
(0.20)
0.9
(0.14)
1.0mm / 0.04in2.6
(0.40)
2.1
(0.33)
1.7
(0.26)
e) specimen:
 SPG-20ASPG-20BSPG-30BSPG-50A
Area2222
0.487in20.487in20.487in20.487in2
  WeightGap:0.5mm / 0.02in0.46g0.44g0.50g0.50g
Gap: 1.0mm / 0.04in0.88g1.00g1.00g

f) Measured by using ASTM D5470 modified, refer to Fujipoly Test method
“FTM P-3030”. See Here

After 1000 hours
Test ConditionSPG-20ASPG-20BSPG-30BSPG-50A
  Gap0.5mm
/ 0.02in
0.5mm
/ 0.02in
1.0mm
/ 0.04in
0.5mm
/ 0.02in
1.0mm
/ 0.04in
  Initial2.1 (0.33)1.8 (0.28)2.1 (0.33)0.9 (0.14)1.7 (0.26)
  +70˚C2.1 (0.33)1.8 (0.28)2.1 (0.33)1.0 (0.16)1.8 (0.28)
  +150˚C2.1 (0.33)1.8 (0.28)2.6 (0.40)1.2 (0.19)1.8 (0.28)
  -40˚C2.2 (0.34)1.8 (0.28)2.1 (0.33)1.1 (0.17)1.8 (0.28)
+60˚C
/95%RH
2.2 (0.34)1.8 (0.28)2.1 (0.33)0.9 (0.14)1.7 (0.26)
-40˚C  +125˚C
/30min each
2.6 (0.40)1.8 (0.28)2.2 (0.34)0.9 (0.14)1.7 (0.26)

Compression Force

1.0mm GapSPG-20ASPG-20BSPG-30BSPG-50A
0.9mm
/ 0.35in
7
(1.6)
9
(2.0)
11
(2.5)
34
(7.7)
0.8mm
/ 0.32in
9
(2.0)
11
(2.5)
17
(3.9)
38
(8.6)
0.7mm
/ 0.28in
12
(2.7)
13
(2.9)
25
(5.7)
45
(10.2)
0.6mm
/ 0.24in
16
(3.6)
17
(3.9)
36
(8.2)
54
(12.2)
0.5mm
/ 0.20in
24
(5.4)
22
(5.0)
50
(11.3)
69
(15.6)
  Sustain0
(0.0)
2
(0.5)
5
(1.1)
16
(3.6)
0.5mm GapSPG-20ASPG-20BSPG-30BSPG-50A
0.45mm
/ 0.18in
30
(6.8)
32
(7.3)
36
(8.2)
80
(18.1)
0.40mm
/ 0.16in
39
(8.8)
42
(9.5)
43
(9.7)
89
(20.2)
0.35mm
/ 0.14in
48
(10.9)
54
(12.2)
55
(12.5)
100
(22.7)
0.30mm
/ 0.12in
66
(15.0)
69
(15.6)
61
(13.8)
119
(27.0)
0.25mm
/ 0.10in
85
(19.3)
86
(19.5)
79
(17.9)
141
(31.9)
Sustain0
(0.0)
3
(0.7)
7
(1.6)
6
(1.4)

g) Sustain: Sustain 50% at 1 minute later.
h) Measured byusing ASTM D575-91(2012) for reference.

Fujipoly: Thermal Interface Materials
ISO 9001:2015