SARCON® SPG-20B Highly Thermal Conductive, Electricity Insulative, Low Viscosity type Silicone Compound


Sarcon® SPG-20B is highly conformable / thermally conductive, low viscosity and easier dispensable type silicone compound. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic devices. Sarcon® SPG-
20B easily forms and adheres to most of surfaces, shapes, and sizes of components.
Sarcon® SPG-20B makes complete and reliable physical contact with the component and opposing surfaces. It provides handling properties that are superior to thermal grease & potting materials.
1) Suitable for filling the delicate gaps and still provide superior thermal transfer.
2) Highly conformable with very low compression forces.
3) Has excellent vibration absorption capabilities.
4) Maintains thermal properties across a wide temperature range.
5) Can be used to “Form-In-Place” and will remain form stable.
6) Requires no heat curing.
7) Will not cause corrosion on any metal surface.

Recommended application

Thermal transfer from heat-generating device to heat spreader or heat sink

Material CodeConstruction
Sarcon® SPG-20BLow Viscosity type
Silicone compound
SARCON® SPG-20B Recommended application
Typical Material Properties
ItemUnitSPG-20BTest method
Specific Gravity-2.8JIS K 6220/(ASTM D792)
ViscosityPa・s1,000Fujipoly test method *1
1,400Fujipoly test method *2
Thermal Conductivity(W/m・K)2.1Fujipoly test method *3

*1: Accurate Rotary Viscometer (RV1) Shearing Speed:1.0 (1/S)
*2: Accurate Rotary Viscometer (RV1) Shearing Speed:0.5 (1/S)
*3: Hot Disk method tester (TPA-501) Based on ASTM D2326 equivalent.

Typical Product Properties
ItemUnitSPG-20BTest method
Operating Temperature Range-40 to +150 
Thermal Resistance℃・cm2/W1.8ASTM D5470 equivalent  *4

*4: Contact Surface: 3.14 cm2, (0.49 inch2) Filled material’s weight: 0.45g for 0.5mm gap

Typical Durability (Reliability)

Thermal resistance under Heat, Cold, Humid and Thermal Shock conditions

GapsInitial100 hrs250 hrs500 hrs1,000 hrsGapsInitial100 hrs250 hrs500 hrs1,000 hrs
GapsInitial100 hrs250 hrs500 hrs1,000 hrsGapsInitial100 hrs250 hrs500 hrs1,000 hrs
+6095RH Aging-40℃⇔+125Heat Shock
GapsInitial100 hrs250 hrs500 hrs1,000 hrsGapsInitial100 hrs250 hrs500 hrs1,000 hrs

Remark: *Unit of Thermal Resistance: ℃・inch2/W based on ASTM D5470 equivalent method
*Contact Surface: 3.14 cm2, (0.49 inch2)
*Filled material’s weight: 0.44 g for 0.5 mm gap

Statement of Lieu of Warranty

• Properties of the products may be revised due to some changes for improving performance.
• Properties values in this document are not specification or guaranteed.
• This product is made of silicone, and silicone oil may exude from the product.
• This product is made of silicone, and low molecular siloxane may vaporize depending on operating conditions.
• The product is designed, developed, and manufactured for general industrial use only. Never use for medical, surgical, and/or relating purposes. Never use for the purpose of implantation and/or other purposes by which apart of or whole product remains in human body.
• Before using, a safety must be evaluated and verified by the purchaser.
• Contents described in the document do not guarantee the performances and qualities required for the purchaser’s specific purposes. The purchaser is responsible for pre-testing the product under the purchaser’s specific.
• Statements concerning possible or suggested uses made herein may not be relied upon, or be constructed, as a guaranty of no patent infringement.

Handling Notes

• It is recommended to use the material in up to 30% of compression ratio. Using the material beyond the recommended compression rate may result in excessive silicone oil exudation.
• It is recommended to compress the material with the equal ratio on the whole surface. Partial excessive stress may also result in excessive silicone oil exudation.

Fujipoly: Thermal Interface Materials
ISO 9001:2015