Glossary of Connector Terminology

ASPECT RATIO (AR)

Ratio of ZEBRA® connector height to width. (Aspect ratio of 1.5 and higher is recommended to minimize the amount of force required to deflect the ZEBRA® connector.)

BEZEL

Positioning device designed to surround the LCD edges while applying force to the ZEBRA® connector. Usually the decorative portion of the connector package. Plastic or metal cover placed over the LCD.

BRIDGE

Rib section on a ZEBRA® connector holder serving to reinforce the holder as well as minimize the length of individual ZEBRA® connection spans.

COMPRESSION SET

Amount by which a compressed ZEBRA® connector will not recover to its original height when compression is removed within the prescribed deflection limits. (typical maximum of 25%)

CONNECTOR PITCH

Center-to-center measurement of conductive layers.

CONTACT DENSITY

Number of conductive layers per inch.

DEFLECTION

Difference in original height versus compressed height of connector

GAP

Space on a PC board or LCD which does not contain contact pads.

HOLDER / RETAINER

Positioning device used to contain the ZEBRA® connector to assure proper alignment between two mating
surfaces.

LCD PITCH AND/OR PC BOARD PITCH

Centerline-to-centerline distance between contact pads.

LIP WIDTH

Distance from outside edge of front glass to edge of back glass.

PAD WIDTH

Distance measured edge-to-edge of contact pad (CW).

PAD LENGTH

Distance measured end-to-end of contact pad (CL).

PAD MATERIALS

LCD contact pads are normally indium tin oxide. PC board contact pads may be gold, carbon-coated or soldercoated. Plating methods can result in significant variations in contact pad thickness, but should be kept as flat as possible.

REGISTRATION

Vertical alignment of contact pads between two mating surfaces.

SEPARATION

Distance between two mating surfaces.

STRESS RELAXATION

The function which relates to the loss of back stress of the compressed connector over time. Expressed as a percent of original stress.

TOLERANCE STACK-UP

Minimum and maximum dimensions of separation between LCD contacts and PC board contacts as determined by consideration of tolerance variations in flatness and parallelism of components.