SARCON® SPG Series: Dispensable Thermal Materials

SARCON® SPG Series materials are non-curable silicone-based form-in-place thermal interface materials that combine thermally conductive ceramic fillers with a dispensable compound. Applied directly onto components or heat sinks, they create an efficient thermal path while conforming to complex geometries, uneven surfaces, and manufacturing tolerances.

Available in multiple thermal conductivity grades and dispensing formats, SPG Series materials provide an effective solution for applications requiring automated dispensing, maximum conformability, and reliable thermal management.

How Form-in-Place Thermal Interface Materials Work

Unlike sheet-based thermal interface materials, SARCON® SPG Series is supplied as a dispensable compound that can be applied manually or using automated dispensing equipment. The material is deposited only where required, creating a custom thermal interface that precisely matches the geometry of the application.

Once dispensed, the material conforms to surface irregularities and component height variations, eliminating air gaps that would otherwise reduce heat transfer. Because the interface is created in place rather than cut from a sheet, SPG Series is particularly well suited to complex assemblies where conventional thermal pads would be difficult to install.

Key Benefits of SARCON® SPG Series Materials

SARCON® SPG Series materials are available in a range of thermal conductivities, allowing engineers to balance thermal performance, dispensing characteristics, and manufacturing requirements.

The dispensable material provides exceptional conformability while requiring minimal mechanical loading to establish effective thermal contact. This helps protect delicate electronic components, solder joints, and printed circuit boards from excessive assembly stress.

Applying the material directly to the assembly also eliminates the need for die-cut thermal pads, simplifies thermal interface design, and supports highly repeatable automated manufacturing processes. Material is deposited only where needed, reducing waste and improving production efficiency.

As with all thermal interface materials, overall thermal performance depends not only on thermal conductivity, but also on interface thickness, material coverage, surface flatness, and assembly design.

Design Considerations

SPG Series materials are intended for manufacturing processes that utilize dispensing equipment. Achieving consistent thermal performance requires proper control of dispensing parameters, material volume, and placement accuracy throughout production. Measures must be taken to prevent material slippage when used in large gaps or vertical applications.

These materials are particularly well suited to applications involving:

• Complex or irregular component layouts
• Large manufacturing tolerances
• Significant component height variations
• Delicate electronic assemblies requiring minimal mechanical stress
• High-volume automated manufacturing

Because SPG Series is dispensed directly onto the assembly, implementation requires appropriate dispensing equipment and process development.

Fujipoly can provide guidance on material selection and dispensing parameters to support reliable production.