Highly Thermally Conductive and Electrically Insulative Silicone free Compound.
SARCON® Form in Place Gap Filler Type is highly conformable and highly thermal conductive type silicone free compound with very low compression force. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic devices. SARCON® Form in Place Gap Filler Type is suitable for filling delicate gaps and still provide superior thermal transfer.
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