SARCON® Thermal Interface Materials
More power and light weight. In the past, these two characteristics in electronics were mutually exclusive. Now, micro-electronics are just that, and in addition, need thermal management components to further complement these objectives.
SARCON is an advanced silicone rubber with high thermal conductivity and superior flame-retardancy. By combining the inherent silicone rubber properties of heat resistance, electrical insulation and long-term aging into one compound, this universally applicable material can be made in an unlimited number of thermal management configurations.
SARCON® Selection Guide
|RUBBER TYPE||Thermal Conductivity
|Material Type||Data Sheet|
|Thin Film with High Thermal Conductivity, Electric Isolation and Non-Flammable.||Hotwire 1.2||TR||View|
|RUBBER TYPE||Measuring Method||Material Type||Data Sheet|
|Thin film with high electric isolation, high mechanical strength with Reinforcement Mesh as well as adhesive one side options.||Hotwire 0.9||GTR||View|
|Standard Gap Filler Type||Measuring Method||Material Type||Data Sheet|
|Highly Conformable, Non-Flammable, Isolation and High Heat Conducting Gel materials.
Gap filler materials are supplied in a fully cured state and remain pliable, easy conforming to minute surface irregularities.
The basic Gap Filler Pad series can be further enhanced for special handling and die-cutting requirements.
|High Performance Gap Filler Type||Measuring Method||Material Type||Data Sheet|
|Highly Conformable and High Heat Conducting gel materials.
SARCON Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form.
They easily fit and adhere to most shapes and sizes of components, including protrusions and recessed areas.
|ASTM D5470 13.0
|Extremely Compressible (Putty) Gap Filler Type||Measuring Method||Material Type||Data Sheet|
|For wider gaps with better compressibility.
Highly Thermally Conductive and Non-Flammable interface materials.
Type is easy to flow and fill gaps with low compression force at high compression rate.
|Standard Gap Filler Type – NON SILICONE||Measuring Method||Material Type||Data Sheet|
|SARCON NR-ｃ is a highly conformable, thermally onductive, acrylate resin non-silicone) sheet with thermally conductive fillers.
Available in sheets and die-cut forms for formal interface uses wherever gap filler pads are traditionally used.
|Electromagnetic Wave Absorption Type||Measuring Method||Material Type||Data Sheet|
|SARCON® Electromagnetic Wave Absorption Type is effective to absorb and damp range of electromagnetic waves, also effective as a high performance thermal interface material.||Hotwire 1.0
|SARCON® Electromagnetic Wave Absorption Type is effective to absorb and damp range of electromagnetic waves, also effective as a high performance thermal interface material.||Hotdisk 3.0||EGR30A||View|
|Form In Place Gap Filler Type Dispensable Single Component)||Measuring Method||Material Type||Data Sheet|
|SARCON® Form in Place Gap Filler Type is highly conformable and highly thermal conductive type silicone compound with very low compression force. It provides a thermal solution for the recent trends of higher frequencies and integration in thedevelopment of electronic device. SARCON® Form in Place Gap Filler Type is suitable for filling the delicate gaps and still providesuperior thermal transfer.||Hotdisk 2.1||SPG-20B||View|
|Grease Type||Measuring Method||Material Type||Data Sheet|
|SARCON® Grease Type ensure the lowest amount of bleed and evaporation. Minimum thickness (Silicone and Non-Silicone formulations).||ASTM D5470
|SG-SL / SG-NS||View|
|New High Performance TIM, 21 W/m-K|
|Extremely Compressible Carbon Fibre Gap filler Type||Measuring Method||Material Type||Data Sheet|
|CF210A is an Ultra high thermally conductive and non-flammable Thermal Interface gap filler material. Incorporating carbon fibre
oriented in the thickness direction, This very soft conforming thermal gap filler exhibits excellent thermal performance for wide
gap application between heat source and heat sink.